Overview
Engineered around an Intel XMP 2.0 profile delivering 3000 MT/s at 1.35V with 16-18-18-38 primary timings, this unbuffered DDR4 module targets mainstream desktop builders seeking reliable bandwidth without excessive voltage overhead. Built upon a 10-layer PCB substrate, the circuit layout maintains trace isolation and signal integrity to suppress electromagnetic interference across high-frequency memory cycles. The module retains standard JEDEC fallback profiles operating at 1.20V, ensuring dependable cold-boot sequence compatibility across Intel 300- through 700-series motherboards as well as AMD AM4 platforms.
Physical heat dissipation is managed through a curved blue anodized aluminum heat spreader with serrated upper teeth designed to maximize passive convective airflow within standard chassis configurations. Standing at a modest height of 1.50 in (38.2 mm), the module avoids physical obstruction beneath large dual-tower air coolers and compact mini-ITX heatsinks. The lack of active components or power-hungry RGB illumination circuitry allows the module to operate strictly within passive thermal tolerances without contributing excess thermal load to adjacent motherboard VRM regions.
In real-world deployment, achieving the advertised 3000 MT/s transfer rate requires a manual BIOS toggle to engage the XMP profile, as motherboards default to baseline JEDEC frequencies on initial installation. As a single 16GB UDIMM configuration, pairing with a matching stick is required to establish dual-channel memory bandwidth, and production ICs can vary across manufacturing lots between major semiconductor suppliers. Backed by factory burn-in validation and a limited lifetime warranty, the module provides a stable, no-nonsense memory foundation for daily computing and gaming builds.
Technical Specifications
| Brand | Silicon Power |
| Model | Turbine DDR4 16GB 3000MHz (SP016GXLZU300BSA) |
| Memory Type | DDR4 SDRAM |
| Form Factor | 288-pin UDIMM |
| Total Capacity | 16 GB (1 x 16GB) |
| Module Configuration | Single Module (1Rx8 / 2Rx8) |
| Tested Frequency | 3000 MT/s (PC4-24000) |
| Tested Latency | 16-18-18-38 |
| Tested Voltage | 1.35V |
| Default JEDEC Frequency | 2133 / 2400 / 2666 MT/s |
| Default JEDEC Voltage | 1.20V |
| Performance Profile | Intel XMP 2.0 (Extreme Memory Profile) |
| PCB Layer Count | 10-layer PCB |
| Heat Spreader Material | Anodized Aluminum |
| Operating Temperature | 32°F to 185°F (0°C to 85°C) |
| Dimensions | 5.25 x 1.50 x 0.26 in (133.4 x 38.2 x 6.5 mm) |
| Weight | 1.27 oz (36 g) |
| Warranty | Limited Lifetime Warranty |
- 10-layer PCB construction ensures clean signal traces and EMI reduction
- Pre-configured Intel XMP 2.0 profile provides one-click 3000 MT/s operation at 1.35V
- Compact 1.50 in (38.2 mm) module height guarantees broad CPU cooler clearance
- Anodized aluminum heat spreader delivers efficient passive thermal dissipation
- Single 16GB stick configuration operates in single-channel mode unless paired with a matching module
- Requires entering BIOS to enable XMP, otherwise defaulting to baseline JEDEC frequencies
- DRAM IC sourcing varies by manufacturing lot, limiting extreme manual overclocking headroom beyond rated XMP
Primary Sources & Audited Citations
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At a Glance
How reliable is the Silicon Power Turbine DDR4 16GB 3000MHz (SP016GXLZU300BSA) Review: Budget Bandwidth on 10-Layer Substrate according to Mizex audits?
Ideal for budget-conscious builders seeking an affordable, low-clearance 16GB DDR4 upgrade, though purchasing a matched pair is recommended to fully unlock dual-channel memory bandwidth.
What are the known quirks or drawbacks of the Silicon Power Turbine DDR4 16GB 3000MHz (SP016GXLZU300BSA) Review: Budget Bandwidth on 10-Layer Substrate?
Our reliability audit identified the following documented caveats:
- Single 16GB stick configuration operates in single-channel mode unless paired with a matching module
- Requires entering BIOS to enable XMP, otherwise defaulting to baseline JEDEC frequencies
- DRAM IC sourcing varies by manufacturing lot, limiting extreme manual overclocking headroom beyond rated XMP
What are the key engineering highlights of the Silicon Power Turbine DDR4 16GB 3000MHz (SP016GXLZU300BSA) Review: Budget Bandwidth on 10-Layer Substrate?
The top strengths recorded in our evaluation include:
- 10-layer PCB construction ensures clean signal traces and EMI reduction
- Pre-configured Intel XMP 2.0 profile provides one-click 3000 MT/s operation at 1.35V
- Compact 1.50 in (38.2 mm) module height guarantees broad CPU cooler clearance
- Anodized aluminum heat spreader delivers efficient passive thermal dissipation