Radxa Cubie A7Z 2GB vs NeoEyes NE302
Standardized 5-pillar engineering audit, thermal telemetry, verified longevity metrics, and complete technical specification diff.
High-density SBC engineering that fits octa-core compute, a 3 TOPS NPU, and PCIe Gen3 into a Pi Zero footprint with expected I/O trade-offs.
A highly efficient fanless vision module with strong NPU performance but limited storage and no battery support.
Mizex Comparative Audit Verdict
5-Pillar Engineering Telemetry
Detailed comparison across standardized normalized 1.0 – 5.0 engineering pillars.
Radxa Cubie A7Z 2GB: Strengths & Caveats
- Integrates dual Cortex-A76 and hexa Cortex-A55 cores with a 3 TOPS NPU in a compact form factor
- Provides high-speed PCIe Gen3 x1 expansion via an onboard FPC connector
- Supports dual display output via Micro HDMI 2.0b and USB-C DisplayPort Alt Mode
- Features modern wireless networking with Wi-Fi 6 and Bluetooth 5.4
- Lacks onboard RJ45 Ethernet and full-size USB Type-A ports, requiring external adapters
- High-speed UFS 3.0 storage requires surface-mount soldering to unpopulated pads rather than a modular socket
NeoEyes NE302: Strengths & Caveats
- Fanless operation enabled by high TOPS/W efficiency
- Hardware-accelerated video encoding (H.264/JPEG)
- Open firmware and developer resources available
- No battery included (USB-C power only)
- Reduced memory/storage compared to NE301 model
- Removed features: 4G LTE, audio wafers, PIR motion connector, PoE support
Technical Specification Comparison
Side-by-side spec alignment. Rows highlighted with subtle shading denote differing specifications.
| Specification | Radxa Cubie A7Z 2GB | NeoEyes NE302 |
|---|---|---|
| Brand DIFF | Radxa | NeoEyes |
| Model DIFF | Cubie A7Z 2GB | NeoEyes NE302 |
| SoC DIFF | Allwinner A733 (A733MX-HN3) | — |
| CPU Architecture DIFF | Dual-core Arm Cortex-A76 @ up to 2.00 GHz, Hexa-core Arm Cortex-A55 @ up to 1.79 GHz, Single-core RISC-V E902 real-time core | — |
| GPU DIFF | Imagination Technologies BXM-4-64 MC1 (OpenGL ES 3.2, Vulkan 1.3, OpenCL 3.0) | — |
| NPU DIFF | 3 TOPS AI accelerator | — |
| VPU DIFF | 8Kp24 H.265/VP9/AVS2 decoding, 4Kp30 H.265/H.264 encoding | — |
| System Memory DIFF | 2GB LPDDR4/4x | — |
| Storage Support DIFF | MicroSD slot, unpopulated footprint for 2-lane UFS 3.0 (64GB to 512GB) | — |
| Display Interfaces DIFF | 1x Micro HDMI 2.0b (up to 4Kp60), 1x USB-C with DisplayPort Alt Mode | — |
| Camera Interface DIFF | 4-lane MIPI CSI connector | — |
| Wireless Connectivity DIFF | Dual-band Wi-Fi 6, Bluetooth 5.4 (Quectel FCU760K module, IPEX antenna connector) | — |
| USB Ports DIFF | 1x USB 2.0 OTG Type-C (power/data), 1x USB 3.1 OTG Type-C (with DisplayPort Alt Mode) | — |
| Expansion Interfaces DIFF | 40-pin color-coded GPIO header, PCIe Gen3 x1 FPC connector | — |
| Form Factor DIFF | Raspberry Pi Zero standard footprint, 2.56 x 1.18 in (65 x 30 mm) | — |
| Power Delivery DIFF | 5V/1A via USB-C or 5V DC via 40-pin GPIO header | — |
| Mcu Core DIFF | — | Arm Cortex-M55 |
| Cpu Frequency DIFF | — | 800 MHz |
| Npu Accelerator DIFF | — | ST Neural-ART @ 1 GHz |
| Npu Performance Gops DIFF | — | 600 GOPS |
| Tops Per Watt DIFF | — | 3 TOPS/W |
| Gpu DIFF | — | Neo-Chrom 2.5D GPU |
| Bpu Encoders DIFF | — | H.264 and JPEG up to 1080p @ 30fps |
| Sram DIFF | — | 4.2 MB |
| Psram DIFF | — | 32 MB |
| Flash Storage DIFF | — | 64 MB SPI Flash |
| Camera Sensor DIFF | — | OS04C10 (4MP) |
| Sensor Fov Wide DIFF | — | 88 degrees |
| Sensor Fov Ultra Wide DIFF | — | 137 degrees |
| Lens Mount DIFF | — | M12 |
| Wifi Standard DIFF | — | WiFi 6 (2.4 GHz) |
| Bluetooth Version DIFF | — | Bluetooth 5.3 LE |
| Antenna Gain Dbi DIFF | — | 3 to 4 dBi |
| Environmental Sensor DIFF | — | SHT31-DIS (Temp/Humidity) |
| Power Input DIFF | — | 5V via USB-C |
| Dimensions Mm DIFF | — | 42 x 42 x 20 mm (1.65 x 1.65 x 0.79 in) |
| Pcb Dimensions Mm DIFF | — | 38 x 38 mm (1.50 x 1.50 in) |
| Operating Temp C DIFF | — | -20 to 50 C |
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