Side-by-Side Comparison
Supermicro NVIDIA Vera Rubin NVL72 Rack vs HPE ProLiant DL145 Gen11
Standardized 5-pillar engineering audit, thermal telemetry, verified longevity metrics, and complete technical specification diff.
● HIGHLY RATED
Supermicro NVIDIA Vera Rubin NVL72 Rack
Composite Score:
4.5
/ 5.0
Next-generation rack-scale powerhouse delivering 216 TB/s NVLink bandwidth and 20.7 TB HBM4 backed by enterprise redundant liquid cooling.
● HIGHLY RATED
HPE ProLiant DL145 Gen11
Composite Score:
4.5
/ 5.0
Ruggedized 2U short-depth edge platform balancing high-efficiency AMD EPYC compute with robust environmental endurance.
⚖️
Mizex Comparative Audit Verdict
Both the Supermicro NVIDIA Vera Rubin NVL72 Rack and HPE ProLiant DL145 Gen11 share an identical composite score of 4.5. Choice between them depends primarily on specific port requirements, physical dimensions, or pricing.
5-Pillar Engineering Telemetry
Detailed comparison across standardized normalized 1.0 – 5.0 engineering pillars.
Supermicro NVIDIA Vera Rubin NVL72 Rack
HPE ProLiant DL145 Gen11
Engineering & Architecture
(30%)
Winner: Supermicro NVIDIA Vera Rubin NVL72 Rack (+0.2)
4.8
4.6
Build Quality & Materials
(20%)
Winner: Supermicro NVIDIA Vera Rubin NVL72 Rack (+0.1)
4.6
4.5
Thermal, Power & Acoustics
(20%)
Winner: Supermicro NVIDIA Vera Rubin NVL72 Rack (+0.2)
4.5
4.3
Real-World Reliability
(20%)
Winner: HPE ProLiant DL145 Gen11 (+0.2)
4.4
4.6
Buyer Value & Upgrades
(10%)
Tie
4.2
4.2
Supermicro NVIDIA Vera Rubin NVL72 Rack: Strengths & Caveats
✔ Advantages
- Unified rack-scale architecture functioning as a single machine with 72 Rubin GPUs and 36 Vera CPUs
- Massive aggregate scale-up bandwidth of 216 TB/s driven by 9 sixth-generation NVLink switch trays
- Substantial memory footprint featuring 20.7 TB HBM4 and up to 54 TB LPDDR5X per rack
- Enterprise DLC-2 direct liquid cooling infrastructure supported by redundant 1.8MW in-row CDUs
✖ Documented Caveats
- Requires specialized high-density data center facilities equipped with comprehensive liquid-cooling loops
- Internal acoustic profiles and tray-level dampening tolerances are pending physical retail teardown
HPE ProLiant DL145 Gen11: Strengths & Caveats
✔ Advantages
- Compact 2U short-depth chassis roughly 50% smaller than standard enterprise 2U servers
- Dense compute scaling up to 64-core AMD EPYC 8004 processors with efficient 200W TDP limits
- Ruggedized operational tolerance from -5°C to +55°C with shock and vibration resistance
- Accommodates up to three single-slot PCIe accelerators for on-premise AI inferencing
✖ Documented Caveats
- Compact chassis constraints prevent installation of larger dual-slot enterprise accelerators
Technical Specification Comparison
Side-by-side spec alignment. Rows highlighted with subtle shading denote differing specifications.
| Specification | Supermicro NVIDIA Vera Rubin NVL72 Rack | HPE ProLiant DL145 Gen11 |
|---|---|---|
| Brand DIFF | Supermicro | HPE |
| Model DIFF | Supermicro NVIDIA Vera Rubin NVL72 Rack | HPE ProLiant DL145 Gen11 |
| Gpu Configuration DIFF | 72x NVIDIA Rubin GPUs | — |
| Cpu Configuration DIFF | 36x NVIDIA Vera CPUs | — |
| Compute Trays DIFF | 18x 1U compute trays (4x Rubin GPUs and 2x Vera CPUs per tray) | — |
| Switch Trays DIFF | 9x 6th-generation NVIDIA NVLink switch trays | — |
| Scale Up Bandwidth DIFF | 216 TB/s | — |
| Gpu Memory DIFF | 20.7 TB HBM4 | — |
| System Memory DIFF | Up to 54 TB LPDDR5X | — |
| Cooling System DIFF | DLC-2 Direct Liquid Cooling (rack manifolds, cold plates, optional rear door heat exchangers) | — |
| Cooling Distribution Unit DIFF | 1.8MW in-row CDU with N+1 redundancy | — |
| Form Factor DIFF | — | 2U short-depth edge server (381 mm x 507 mm) |
| Processor Architecture DIFF | — | AMD EPYC 8004 Series (Siena), up to 64 cores |
| Processor Socket DIFF | — | Single socket (1P) |
| Processor Maximum TDP DIFF | — | 200W |
| Memory Type DIFF | — | DDR5 ECC Registered |
| Memory Subsystem DIFF | — | 6-channel, up to 4800 MT/s |
| PCIe Expansion DIFF | — | Supports up to 3x single-slot PCIe accelerators |
| Storage Interface DIFF | — | E3.S NVMe drive bays |
| Management Controller DIFF | — | HPE Integrated Lights-Out (iLO) |
| Operating Temperature Range DIFF | — | -5°C to +55°C |
| Chassis Ruggedization DIFF | — | Shock and vibration resistant |
| Load Power Draw DIFF | — | 196W - 301W |
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